Ethio Telecom would like to Invite Eligible Bidders for the Supply of Lay Epoxy and Hardener Floor Finish Construction at Debre Berhan


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Bid closing date
May 07, 2024 5:00 PM
Bid opening date
May 08, 2024 10:00 AM
Published on
ethiotelecom (Apr 09, 2024)
Posted
Bid document price
100.00 ETB
Bid bond
50,000.00 ETB
Region
Tender Documents
epoxy Bid document.
Price: ETB 100
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File size: 18 MB

FLOATING DATE: AS OF APRIL 15, 2024

RFQ No. 4263973

Requirements

Ethio Telecom invites all interested and eligible bidders by this National Competitive Bid (NCB) for the procurement of Supply and Lay Epoxy and Hardener Floor Finish Construction at Debere Berhan with RFQ No. 4263973. The Tender remains floating from April 15 to May 7, 2024.

andBid documents can be obtained from websites www.2merkato.com and www.afrotender.com upon payment of a non-refundable fee of Birr 100.00 (Birr One hundred only) by using the tele birr payment platform.

In addition, If you are interested in being on the supplier list of Ethio Telecom please register using the following link or copy and paste the link on a browser
https://erp.ethiotelecom.et/OA_HTML/jsp/pos/suppreg/SupplierRegister.jsp?ouid=0EED8A04B857259C”.

1. Interested bidders are expected to fulfill the Requirements stated here below:

  1. Furnish bid security with ETB 50,000.00 (Fifty Thousand Birr)
  2. Availability of Letter of Authorization to sign the bid offers;
  3. Valid and renewed trade license for the year;
  4. VAT registration certificate.
  5. Valid tax clearance certificate
  6. Bid submission sheet
  7. Legal establishment of the company including joint venture (if any)

1.1 The Bid must be accompanied by a bid security in the amount of Birr 50,000.00 (Birr Fifty Thousand only) The bid bond shall be furnished in one of the following forms: -

  1. Certified Cheque /CPO issued by a recognized domestic bank or
  2. Bond issued by and/or confirmed through a recognized/reputable Domestic bank.

1.2 The Bank that issues the bond as per 3.1 (b) here above shall unequivocally guarantee to pay the purchaser immediately upon the first written demand of payment. The Purchaser’s written demand of payment shall not be subject to any condition whatsoever.

1.3 The bond issuing bank shall clearly incorporate the content stated under Clause here above on the issued bond.

1.4 Sealed bids marked as “Tender for the procurement of Supply and Lay Epoxy and Hardener Floor Finish Construction at Debere Berhan with RFQ No. 4263973. and be addressed to:

Ethio telecom,
Head Quarter
Churchill Road
Supply Chain Division
2nd Floor, Room No.211B,
P. O. Box 1047, Addis Ababa, Ethiopia. 

2. Bid proposal will be received at Ethio Telecom, Head Quarter 2nd Floor, Room   No. 211B, before or on May 7, 2024, until 5:00 P.M. Bids presented by any bidder after the closing date shall not be accepted.                                                                                                
3. Bids received in time and fulfilling the other formalities shall be opened in the presence of interested bidders or their legal representatives on May 8, 2024 at 10:00 A.M, at ethio telecom, Head Quarter 2nd Floor, Room No.210. 

4. Partial bid is not allowed.

5. No one is allowed to duplicate or transfer the bidding document that she/he acquired to participate under this invitation.

6. Bidders are seriously advised to read and comply with the instructions provided in this bidding document.

7. Ethio telecom reserves the right to reject all or parts of this bid

           

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